GENUSION TOP > Chronology
GENUSION, Inc. was established
First 50nm gate length B4-Flash operation was confirmed by single cell test vehicle.
GENUSION started OEM Production of 2 Chip Flex MCP for Mobile phone application.
GENUSION started OEM Production of 3 Chip Flex MCP for Mobile phone application..
B4-Flash array operation and reliability was confirmed by using 130nm, 4Mbit Test Chip Array.
GENUSION presented a paper of B4-Flash concept and world first 50nm gate length NOR type flash memory cell operation at the 2006 Symposium on VLSI Technology.
At the 22nd Non-Volatile Semiconductor Memory Workshop, GENUSION presented the results of B4-Flash technology.
GENUSION presented a paper of 4Mb B4-Flash Test Array Chip evaluation results and related circuit technologies at the 22nd Non-Volatile Semiconductor Memory Workshop.
GENUSION was selected as a winner of Technology Innovation Prize in Nokia’s “Mobile Rules! 2008’ Competition; The Best Future Device Architecture”
GENUSION was certified as conforming to ISO14001 EMS.
GENUSION presented two papers of “B4-Flash” reliability and “eCFlash” Test Array Chip evaluation results at the 23rd Non-Volatile Semiconductor Memory Workshop.
GENUSION fabricated 90nm 64Mb B4-Flash Test Array Chip and got first silicon function.
GENUSION, Inc. was selected in the list of 60 Emerging Startups (Silicon 60) by EE Times.
GENUSION presented a paper of eCFlash reliability evaluation results at the 1st IEEE International Memory Workshop.
Innovation Network Corporation of Japan (INCJ) announced and executed investment to GENUSION, Inc.
GENUSION opened Tokyo Design Center (TDC) to expand its design capabilities in "Kanagawa Science Park" (KSP), Kawasaki-city, Kanagawa-pref and started its operation.
GENUSION established its subsidiary to provide B4-Flash memory solution in China memory market rapidly grown thanks to mobile phones.
GENUSION and ROHM Group have entered into a B4-Flash technology, license agreement.
GENUSION and J-DEVICES have Entered into a License Agreement with respect to GENUSION’s Proprietary Packaging Technology, “Si-Capsule Technology”.
GENUSION exhibited a booth and presented a paper regarding B4-Flash technology for data storage application at Flash Memory Summit 2013 in Santa Clara.
GENUSION’s high security data storage technology, “CE-File Memory (Completely Erasable-File Memory)” was published by Nikkei Trendy Net in the article of “Trend Focus”.